Lead-free Solders: Materials Reliability for Electronics provides a comprehensive understanding of the current state of lead-free electronic interconnects research from fundamental, applied, and manufacturing perspectives. The main thematic areas addressed include:

  • Alloy development
  • Composite approaches (including nanoscale reinforcements)
  • Thermomechanical fatigue
  • Electromigration
  • Whisker growth
  • Reliability under impact loading
  • Accelerated thermal cycling
  • Long-term reliability
  • High temperature lead-free solders

Lead-free Solders: Materials Reliability for Electronics:

  • Provides a comprehensive review of the current state of knowledge for implementing lead-free electronics required under recent legislation
  • Includes articles on alloy development, electromigration and long-term reliability
  • Contains contributions from academic, industrial and national laboratory researchers

Representing a major resource in material design for microelectronics development and manufacturing this is essential reading for Researchers in materials science and electronic/electrical engineering in both academia and industry, as well as graduate students in these fields. Physicists and chemists involved in lead-free electronics will also find this of interest.